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Electroplating Raw Copper Lead Frame with Electroplating Surface

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Jinan Jingheng Electronics Co., Ltd.

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Electroplating Raw Copper Lead Frame with Electroplating Surface

Model NO. : leadframe

Material : Raw Copper material

Mould : Stamping tooling

Surface Processing : Electroplating

Process : Forming Process

Industry : Electronics

Customized : Customized

Transport Package : Pallte

Origin : China

Place of Origin : China

Certification : ISO9001:2015, ISO14001:2015, IATF16949

MOQ : 3,000 Pieces

Price : Negotiable

Delivery Time : Peak Season Lead Time: one month Off Season Lead Time: within 15 workdays

Payment Terms : LC, T/T, PayPal

Supply Ability : 10000000000piece/Year

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JINAN JINGHENG ELECTRONICS CO., LTD(Leadframe Factory). The company has strong technical force, sophisticated process equipment, and complete testing devices. It has advanced High-speed Presses and Automatic Roll to Roll Electroplating Line introduced from Japan, with an annual production capacity of 2 billion Semiconductor Integrated Circuit Lead frames and 2 billion Semiconductor Discrete Device Lead frames.
At present, the company's major products are LED series, TO series, SMA series, ABS Bridge and SOP series, DIP series, etc. Since 2015, the company has further expanded its business scope, and added Tin-plating processing of electronic components.

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